The influence of research and development of ultra-high thermal conductivity and ultra-flexible thermal gasket products on the market
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2022-09-22 14:02
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Ultra-high thermal conductivity and ultra-flexible thermal pads are a series of products with a thermal conductivity greater than 12W/m·K and excellent compliance, as shown in Table 1. This series of products is designed to solve the problem of heat dissipation between the heating device and the heat sink of highly integrated electronic equipment with high heat flux density. The ultra-flexibility of this series of materials can quickly fill irregular rough surfaces, ensure excellent interfacial wettability and interface adaptability, effectively eliminate the thermal resistance generated by the air between the interfaces, reduce the thermal resistance of the interfacial contact, form a good heat transfer bridge, and facilitate the heat export of heating devices.
Special instructions
v Before cutting, please tear off the blue release film on one side, when you peel off the blue release film, it is normal for the film to have a mist on the film, which will not affect the performance of the material.
v Any release film must be peeled slowly (less than 150 cm/min) and at a lower peel angle. Peeling too quickly, or at too large a peeling angle, can cause the material to delaminate and stick to the release film.
v In order to minimize the delamination of the material and prevent the material from sticking to the release film, peel off the release film slowly.
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These waste heat will increase the temperature of electronic equipment, resulting in reduced stability of equipment performance, and even damage to the entire system, which will seriously cause accidents such as equipment fire, at the same time, if the heat dissipation is not in place, it will greatly reduce the service life of electronic equipment.
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