Application and development trend of thermal conductivity absorbing materials
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2022-09-22 14:02
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With the development of electronic technology, from electronic consumer goods such as mobile phones, tablet computers, to 5G communication RFFE/antenna modules, MIMO, wifi6, radar and optical communication optical modules and other new generation of electronic components have higher data transmission rates, higher power density and higher frequency bands, and electronic equipment is required to maintain the existing volume or even reduce the volume while having more functional modules, so that electronic equipment will produce a large amount of waste heat when working. These waste heat will increase the temperature of electronic equipment, cause the stability of equipment performance to decrease, and even cause damage to the entire system, serious will cause equipment fire and other accidents, at the same time, if the heat dissipation is not in place, it will also greatly reduce the service life of electronic equipment.
The use of high thermal conductivity materials can effectively evacuate excess heat and meet the thermal management needs of equipment, which is very necessary for high-power systems. At the same time, with the increase of the power density of electronic components, the electromagnetic wave radiation interference caused by it has also attracted more and more attention, in order to improve the anti-electromagnetic interference ability of the equipment, the electronic packaging materials also need to have a certain electromagnetic wave absorption performance to protect the normal operation of electronic components. EMI solutions can create thermal problems and vice versa. As a result, it is difficult to solve EMI or heat dissipation issues alone, and it is increasingly becoming a problem for engineers to address both, especially if they need to be both. Thermally conductive absorbing materials came into being.
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